CHILLDYNE & DDC Solutions to Unveil 600 kW Air and Liquid to Chip Cooling Solution at NVIDIA GTC
San Diego, CA – March 11, 2025 – DDC Solutions, the leader in data center cooling and management technology, is excited to announce that it will unveil its 600kW air and liquid-to-chip cooling joint solution with partner Chilldyne, the leading provider of negative pressure, direct to chip cooling technology. This debut will be at the NVIDIA GTC AI Conference, taking place from March 17-21 in San Jose, CA. DDC Solutions will be exhibiting and speaking at this premier event, showcasing their latest innovations in data center cooling live in booth #1136.
DDC Solutions will be joined in their booth by Chilldyne, with an operating demonstration of an ultra-high-density air and liquid-to-chip cooling solution. In this collaboration, Chilldyne’s cutting-edge technology supports up to 500 kW of chip-level thermal dissipation, while DDC’s S-Series V4 cabinets provide an additional 100 kW of air cooling. The combined solution will be capable of bringing a remarkable 600 kW of cooling per rack.
“The integration between DDC cabinets and Chilldyne’s direct-to-chip cooling technology highlights the ease with which high-density workloads can be deployed in data centers and colocation facilities, regardless of the facility’s original thermal design” said Alan Russo, Chief Revenue Officer at DDC. “We are excited to show off how innovative features like DDCs NEMA 3R certification, built-in security, and fire suppression, redundant motors and coils, and granular environmental control, help to future proof and mitigate risk for high-end, expensive GPU deployments.”
“Chilldyne’s innovative negative pressure technology creates a vacuum to circulate water by pulling it through the cooling system. This approach removes the need for costly, heavy-duty plumbing to the racks, ensures easy setup and upkeep, and eliminates leaks in a system with no single point of failure,” said Steve Harrington, Founder and CEO of Chilldyne. “The four key elements of our CDU-to-Cold Plate solution are the CDU, Rack Manifold, Cold Plates and our Cool-Flo software, enabling us to remotely monitor and operate the Chilldyne CDU using a web-based interface, industry-standard protocol, or integration with DCIM and BMS software.”
In addition to the booth and demo, Chris Orlando, Co-founder and Chief Strategy Officer at DDC Solutions will be speaking on “Data Center Operators Must Lower Risk as GPU Costs Rise: Future-Proof Your Data Center” at the GTC Expo Theater on March 18, 2025, at 4:20 pm. In this session, Chris will address the growing demand for AI accelerators and the rising costs associated with deploying GPUs, power, cooling, and data center construction. He will also discuss how DDC mitigates risk by lowering the loss footprint from an entire data center to a single cabinet, while delivering ultra-high-density cooling.
For more information and to schedule a demo or meeting visit ddcsolutions.com/gtc-2025.