CHILLDYNE & DDC Solutions Unveil 600 kW Air & DTC Cooling at GTC
San Diego, CA – March 11, 2025 – DDC Solutions, the leader in data center cooling and management technology, is excited to announce that it will unveil its 600kW air and liquid-to-chip cooling joint solution. This is in partnership with Chilldyne, the leading provider of negative pressure, direct-to-chip cooling technology. This debut will be at the NVIDIA GTC AI Conference, taking place from March 17-21 in San Jose, CA. DDC Solutions will be exhibiting and speaking at this premier event. They will showcase their latest innovations in data center cooling live in booth #1136.
DDC Solutions will be joined in their booth by Chilldyne,
With an operating demonstration of an ultra-high-density air and liquid-to-chip cooling solution, the collaboration highlights impressive technology. Chilldyne’s cutting-edge technology supports up to 500 kW of chip-level thermal dissipation. Meanwhile, DDC’s S-Series V4 cabinets provide an additional 100 kW of air cooling. The combined solution will be capable of bringing a remarkable 600 kW of cooling per rack. This demonstrates the strength of Chilldyne & DDC Solutions working together.
“The integration between DDC cabins and Chilldyne’s direct-to-chip cooling technology highlights the ease with which high-density workloads can be deployed. This is possible in data centers and colocation facilities, regardless of the facility’s original thermal design,” said Alan Russo, Chief Revenue Officer at DDC. “We are excited to show off how innovative features like DDC’s NEMA 3R certification, built-in security, and fire suppression, help to future-proof and mitigate risk. Other features include redundant motors and coils, and granular environmental control. All of these features support high-end, expensive GPU deployments.”
“Chilldyne’s innovative negative pressure technology creates a vacuum to circulate water. It does this by pulling it through the cooling system. This approach removes the need for costly, heavy-duty plumbing to the racks. It ensures easy setup and upkeep, and eliminates leaks in a system with no single point of failure,” said Steve Harrington, Founder and CEO of Chilldyne. “The four key elements of our CDU-to-Cold Plate solution are the CDU, Rack Manifold, Cold Plates and our Cool-Flo software. This enables us to remotely monitor and operate the Chilldyne CDU using a web-based interface. It also works with industry-standard protocol, or integration with DCIM and BMS software.” Such synergy between Chilldyne & DDC solutions is what sets this technology apart.
Chris Orlando, Co-founder and Chief Strategy Officer at DDC Solutions will be speaking
In addition to the booth and demo, Chris Orlando, Co-founder and Chief Strategy Officer at DDC Solutions will be speaking on “Data Center Operators Must Lower Risk as GPU Costs Rise: Future-Proof Your Data Center.” This will be at the GTC Expo Theater on March 18, 2025, at 4:20 pm. In this session, Chris will address the growing demand for AI accelerators and the rising costs. These costs are associated with deploying GPUs, power, cooling, and data center construction. He will also discuss how DDC mitigates risk. They do this by lowering the loss footprint from an entire data center to a single cabinet. Additionally, they deliver ultra-high-density cooling, thanks to the partnership with Chilldyne and DDC solutions.
For more information and to schedule a demo or meeting visit ddcsolutions.com/gtc-2025.