Solutions
Direct-to-chip liquid cooling can handle higher densities than air cooling, while using almost half of the power required by server fans and computer-room air conditioners.
1). Cooling Distribution Unit (CDU)
The CF-CDU300 provides coolant to up to 300 kW of high-density servers . Its patented, negative-pressure technology means you won’t have to worry about water leaks.
2). Cool-Flo Software
Conveniently monitor and operate the CF-CDU300 via a web interface, DCIM software, or BMS software.
3). Rack Manifold
Installed inside a server rack, the manifolds deliver coolant to more than 100 servers. Quick connectors make it easy to connect or disconnect servers.
4). Cold Plates
Mounted directly to the processor, coolant circulates through the cold plate to remove heat from the most powerful CPU or GPU.
The Chilldyne Difference
Chilldyne’s patented, negative pressure technology creates a vacuum to pull water through the cooling ecosystem, eliminates the need for expensive and reinforced hardware, simplifies installation and maintenance, and provides peace of mind that the system won’t leak.
Liquid Cooling Power Savings
Chilldyne’s System is an efficient and low cost liquid cooling system that reduces data center power consumption 3 ways:
• 75-100% reduction in HVAC power
• 75% reduction in server fan power
• 5-10% reduction in CPU power
This example shows a legacy data center power reduction of 45% with the Cool-Flo System. Any data center can bring their Power Usage Efficiency (PUE) down to 1.2 or less plus additional power savings at the server.