Publication

Featured Industry Report: The Future of Liquid Cooling in AI Computing and the Value of Negative Pressure Technology

Chilldyne’s liquid cooling technology, featuring cold plates with turbulators, provides a reliable and efficient solution to manage the high heat loads from modern HPC and AI applications. This graph highlights the thermal performance of our 2,000-watt cold plate, showing how advanced turbulator technology significantly improves heat transfer. Figure 1: Thermal performance of the Chilldyne cold

Chilldyne’s Reference Design for AI: Leak-Proof Cooling for NVIDIA GB200 NVL72 Clusters AI workloads are more demanding than ever, requiring powerful, high-density computing infrastructure. As these systems scale, cooling becomes a critical challenge—one that traditional methods struggle to meet. That’s why Chilldyne’s patented negative pressure liquid cooling is designed to deliver fail-safe, leak-proof performance for

Sandia National Labs deployed Manzano supercomputer at their Albuquerque HPC data center with Chilldyne’s negative pressure liquidcooling system. Chilldyne’s cooling solution reduces the computer system’s energy use without risk of leaks.